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US announces $1.4 billion support for next-generation semiconductor advanced packaging

January 16, 20251 view0

(Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

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US announces $1.4 billion support for next-generation semiconductor advanced packaging

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US announces $1.4 billion support for next-generation semiconductor advanced packaging

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